中文
|
English
Search
Home
Products
Return
MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Return
Dow
Return
MITSUDEN
Application
Return
general industry
Return
adhesive fixing glue
thermal conductive potting glue
thermal conductive glue
conformal coating
surface treatment
cleaning agent
grease
pipe thread seal
pipe thread locking
automotive industry
Return
bonding sealant
potting glue
thermal conductive glue
conformal coating
filling potting glue
styrofoam
grease
structural bonding
communication electronics
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
electromagnetic shielding glue
conductive glue
underfill glue
home appliance industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
hot melt glue
LED industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
audio industry
Solution
Return
Market application
Product application
News
Return
Company news
Industry information
About us
Return
Brand introduction
Culture
Honors
Corporate video
Manufacturing base
Contact us
Return
Recruitment
Return
social recruitment
campus recruitment
Contact us
Official account
Home
Products
Return
MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Return
Dow
Return
MITSUDEN
Application
Return
general industry
Return
adhesive fixing glue
thermal conductive potting glue
thermal conductive glue
conformal coating
surface treatment
cleaning agent
grease
pipe thread seal
pipe thread locking
automotive industry
Return
bonding sealant
potting glue
thermal conductive glue
conformal coating
filling potting glue
styrofoam
grease
structural bonding
communication electronics
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
electromagnetic shielding glue
conductive glue
underfill glue
home appliance industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
hot melt glue
LED industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
audio industry
Solution
Return
Market application
Product application
News
Return
Company news
Industry information
About us
Return
Brand introduction
Culture
Honors
Corporate video
Manufacturing base
Contact us
Return
Recruitment
Return
social recruitment
campus recruitment
Contact us
Official account
中文
|
English
Products
MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Dow
thermal grease
thermal paste
potting glue
printable thermal pad
conformal paint
filled with silicone gel
silicone primer
silicone oil
bonding
MITSUDEN
Your Current Position:
Products
>
Agent products
>
Dow
>
potting glue
Search
Dow DOWSIL™ EG-3896 硅胶 密封胶
Dow DOWSIL™ EG-3896透明硅胶密封胶是一种双组分,有些模糊或者透明,快速热固化有机硅凝胶,用于灌封,密封,封装和保护电子行业的各种材料。它具有流动性,抗裂纹性,并可固化成柔软的材料。1:1混合比例。
>Details
Dow DOWSIL™ 3-6635 硅胶
>Details
CN8760G
产品型号:CN8760G
品牌:道康宁
产品特点:阻燃UL94V-0,低粘度
适用场合:电源的灌封
>Details
DOWSIL CN8760 导热灌封胶
产品型号:CN8760
品牌:道康宁
产品特点:阻燃UL94V-0,低粘度
适用场合:电源的灌封
>Details
Sylgard®567
产品型号:Sylgard®567
品牌:道康宁
产品特点:低粘度,无底漆灌封胶
适用场合:电子元件的无底漆灌封
>Details
Dow SYLGARD™184 硅胶 密封胶
产品型号:Sylgard®184
品牌:道康宁
产品特点:透明,室温固化,硬度较高
适用场合:电气电子的封装和灌封
>Details
Dow SYLGARD™170 硅胶 密封胶
产品型号:Sylgard®170
品牌:道康宁
产品特点:阻燃UL94V-0等级,导热,低粘度
适用场合:电源模块散热部件灌封
>Details
Dow SYLGARD™160 硅胶 密封胶
产品型号:Sylgard®160
品牌:道康宁
产品特点:阻燃UL94V-0等级,导热,高粘度
适用场合:电源模块散热部件灌封
>Details