中文
|
English
Search
Home
Products
Return
MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Return
Dow
Return
MITSUDEN
Application
Return
general industry
Return
adhesive fixing glue
thermal conductive potting glue
thermal conductive glue
conformal coating
surface treatment
cleaning agent
grease
pipe thread seal
pipe thread locking
automotive industry
Return
bonding sealant
potting glue
thermal conductive glue
conformal coating
filling potting glue
styrofoam
grease
structural bonding
communication electronics
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
electromagnetic shielding glue
conductive glue
underfill glue
home appliance industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
hot melt glue
LED industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
audio industry
Solution
Return
Market application
Product application
News
Return
Company news
Industry information
About us
Return
Brand introduction
Culture
Honors
Corporate video
Manufacturing base
Contact us
Return
Recruitment
Return
social recruitment
campus recruitment
Contact us
Official account
Home
Products
Return
MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Return
Dow
Return
MITSUDEN
Application
Return
general industry
Return
adhesive fixing glue
thermal conductive potting glue
thermal conductive glue
conformal coating
surface treatment
cleaning agent
grease
pipe thread seal
pipe thread locking
automotive industry
Return
bonding sealant
potting glue
thermal conductive glue
conformal coating
filling potting glue
styrofoam
grease
structural bonding
communication electronics
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
electromagnetic shielding glue
conductive glue
underfill glue
home appliance industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
hot melt glue
LED industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
audio industry
Solution
Return
Market application
Product application
News
Return
Company news
Industry information
About us
Return
Brand introduction
Culture
Honors
Corporate video
Manufacturing base
Contact us
Return
Recruitment
Return
social recruitment
campus recruitment
Contact us
Official account
中文
|
English
Products
MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Dow
thermal grease
thermal paste
potting glue
printable thermal pad
conformal paint
filled with silicone gel
silicone primer
silicone oil
bonding
MITSUDEN
Your Current Position:
Products
>
MITSUBOND
Search
TF-700蓝胶
TF-700 是一款单组分溶剂型室温固化绝缘防潮剂,具有较好的耐高低温性及良好的绝缘性能,可起到吸冲缓冲以及屏障污染的功效,专为 LCM 模块(COG、COFTAB、TCF)的绝缘、防潮和保护场景设计,也可广泛应用于玻璃蚀刻临时遮蔽、ITO 屏保护等工艺防护场景。
>Details
TF-400蓝胶
TF-400 是一款单组分溶剂型室温固化绝缘防潮剂,具有较好的耐高低温性及良好的绝缘性能,可起到吸冲缓冲以及屏障污染的功效,专为 LCM 模块(COG、COFTAB、TCF)的绝缘、防潮和保护场景设计,也可广泛应用于玻璃蚀刻临时遮蔽、ITO 屏保护等工艺防护场景。
>Details
TF-100蓝胶
TF-100 是一款单组分溶剂型室温固化绝缘防潮剂,具有较好的耐高低温性及良好的绝缘性能,可起到吸冲缓冲以及屏障污染的功效,专为 LCM 模块(COG、COFTAB、TCF)的绝缘、防潮和保护场景设计,也可广泛应用于各类器件的保护增强。
>Details
TC-3253
TC-3253 是一款高导热双组份有机硅灌封胶,可有效提高元器件、印刷线路板的防潮、绝缘、抗振能力,同时具备优异的耐高低温、应力释放、材料强度与阻燃特性,能充分保障元器件的长期可靠性。产品主打超高导热性能,在提供全面防护的同时,实现高效热量传递,专为高功率、高发热电子器件的灌封场景设计。
>Details
TC-3252
TC-3252 是一款双组份有机硅灌封胶,可有效提高元器件、印刷线路板的防潮、绝缘、抗振能力,同时具备优异的耐高低温、应力释放、材料强度与阻燃特性,可充分保障元器件的长期使用可靠性。产品自带稳定的导热性能,兼顾防护与辅助散热双重需求,广泛适配各类电子器件的灌封防护场景。
>Details
MitsuBond BA-3230A/B
MitsuBond BA-3230A/B 是一款双组份导热粘接材料,专为发热元器件与散热器等结构件的粘接场景设计。产品兼具优秀的结构粘接能力与稳定的热传导性能,可在各类基材间形成牢固粘接的同时,实现高效的热量传递,适配各类热敏结构件的粘接固定需求。
>Details
MitsuBond 3201
MitsuBond 3201 是一款单组份低温热快速固化改良型环氧树脂胶粘剂,可在较低温度、极短时间内,在多种不同类型的材料之间形成极佳的粘接力。产品工作性能优良,储存稳定性高,专为低温固化制程、热敏感性元器件的粘接场景设计。
>Details
MitsuJet 1662
MitsuJet 1662 是一款高性能 PUR(湿气固化)结构胶,具备粘接迅速、无污染、无毒、低挥发的核心特点。同时具有操作温度低、粘度小、开放式时间长、初粘力高、持粘力强的优势,专为 铝合金 材质的粘接场景设计,广泛适配对金属材料有粘接需求的结构件固定,以及汽车 / 风电抗震动部件、户外设备、电子精密粘接等工业场景。
>Details
MitsuJet 1661
MitsuJet 1661 是一款高性能 PUR(湿气固化)结构胶,具备粘接迅速、无污染、无毒、低挥发的核心特点。同时具有操作温度低、粘度小、开放式时间长、初粘力高、持粘力强的优势,专为 PC+ABS 材质的粘接场景设计,广泛适配消费电子结构粘接及各类需要高可靠性粘接的工业场景。
>Details
MitsuJet 1660
MitsuJet 1660 是一款高性能 PUR(湿气固化)结构胶,具备粘接迅速、无污染、无毒、低挥发的核心特点。同时具有操作温度低、粘度小、开放式时间长、初粘力高、持粘力强的优势,专为 TP + 中框 等材质的粘接场景设计,广泛适配消费电子结构粘接及各类需要高可靠性粘接的工业场景。
>Details