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One-component epoxy adhesive
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UV glue
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general industry
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adhesive fixing glue
thermal conductive potting glue
thermal conductive glue
conformal coating
surface treatment
cleaning agent
grease
pipe thread seal
pipe thread locking
automotive industry
Return
bonding sealant
potting glue
thermal conductive glue
conformal coating
filling potting glue
styrofoam
grease
structural bonding
communication electronics
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
electromagnetic shielding glue
conductive glue
underfill glue
home appliance industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
hot melt glue
LED industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
audio industry
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Sylgard®567
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potting glue
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Sylgard®567
1
Sylgard®567
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shared:
应用介绍
产品参数
产品型号:Sylgard®567
品牌:道康宁
产品特点:低粘度,无底漆灌封胶
适用场合:电子元件的无底漆灌封
典型用途:
低成本无底漆附着力;
封装,电气/电子设备的保护。
品牌:
SYLGARD
颜色:
黑色
组份:
双组份
固化方式:
加热
固化时间:
120分钟@ 100°C;
在70°C下180分钟;
介电强度:
16KV/mm
硬度:
40 A.
混合比例
:
按体积比1:1;
按重量计1:1
工作温度:
-45至200°C
比重(固化)
:
1.24
导热率:
0.29 W / mK
粘度:
A组份:2060 cp,B组份:570 cp
体积电阻率:
6 x 10 ^ 16 ohm-cm
File Download
567 TDS EN.pdf
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