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One-component epoxy adhesive
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Return
adhesive fixing glue
thermal conductive potting glue
thermal conductive glue
conformal coating
surface treatment
cleaning agent
grease
pipe thread seal
pipe thread locking
automotive industry
Return
bonding sealant
potting glue
thermal conductive glue
conformal coating
filling potting glue
styrofoam
grease
structural bonding
communication electronics
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
electromagnetic shielding glue
conductive glue
underfill glue
home appliance industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
hot melt glue
LED industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
audio industry
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Dow DOWSIL™ SE9184 有机硅 导热胶
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Dow DOWSIL™ SE9184 有机硅 导热胶
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Dow DOWSIL™ SE9184 有机硅 导热胶
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应用介绍
产品参数
产品型号:SE9184
品牌:DOWSIL
产品特点:快速表干
适用场合:IC基材,外壳与盖子,散热器之间的粘合
典型应用:
粘接集成电路基板;粘附盖子和外壳;粘结散热片
品牌:
DOWSIL
颜色:
白色
组份:
单组份
固化时间:
48h @25
°C
介电强度:
20 kV/mm
硬度:
74 A
工作温度:
-45 to 200 °C
剪切强度:
1.7 MPa
比重(固化):
2.2
表干时间:
3min
拉伸强度:
3.2 MPa
粘度:
Non-flow
体积电阻率:
1.5*10^15 ohm-cm
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SE9184 TDS EN.pdf
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