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MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Return
Dow
Return
MITSUDEN
Application
Return
general industry
Return
adhesive fixing glue
thermal conductive potting glue
thermal conductive glue
conformal coating
surface treatment
cleaning agent
grease
pipe thread seal
pipe thread locking
automotive industry
Return
bonding sealant
potting glue
thermal conductive glue
conformal coating
filling potting glue
styrofoam
grease
structural bonding
communication electronics
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
electromagnetic shielding glue
conductive glue
underfill glue
home appliance industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
hot melt glue
LED industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
audio industry
Solution
Return
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Product application
News
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Industry information
About us
Return
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Honors
Corporate video
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Contact us
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MITSUDEN
DOWSIL™ Q3-6611 Adhesive
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bonding
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DOWSIL™ Q3-6611 Adhesive
1
DOWSIL™ Q3-6611 Adhesive
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shared:
应用介绍
产品参数
产品型号:Q3-6611
品牌:道康宁
产品特点:流动性好,加热固化,高弹性强度,无溶剂添加
适用场合:粘接、密封
典型用途:
密封盖和外壳;
安装底板;
密封垫;
连接器密封。
品牌:
DOWSIL
颜色:
黑色
组份:
单组分
固化方式:
加热固化
固化时间:
在150°C下30分钟;
在125°C下60分钟
硬度:
59 A.
工作温度:
-45至200°C
剪切强度:
6.1 MPa
比重
:
1.3 1@ 25°C
粘度:
87025
File Download
DOWSIL™ Q3-6611 Adhesive Technical Data Sheet EN.pdf
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