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MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Return
Dow
Return
MITSUDEN
Application
Return
general industry
Return
adhesive fixing glue
thermal conductive potting glue
thermal conductive glue
conformal coating
surface treatment
cleaning agent
grease
pipe thread seal
pipe thread locking
automotive industry
Return
bonding sealant
potting glue
thermal conductive glue
conformal coating
filling potting glue
styrofoam
grease
structural bonding
communication electronics
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
electromagnetic shielding glue
conductive glue
underfill glue
home appliance industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
hot melt glue
LED industry
Return
bonding sealant
potting glue
thermal conductive glue
protective coating
filling potting glue
audio industry
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中文
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English
Products
MITSUCOAT
MITSUBOND
One-component epoxy adhesive
Two-component epoxy adhesive
UV glue
Agent products
Dow
thermal grease
thermal paste
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filled with silicone gel
silicone primer
silicone oil
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DOWSIL™ 340
产品型号:340
品牌:道康宁
产品特点:低渗油,高温稳定性
适用场合:热源与散热器之间的导热
>Details
TC5625C
产品型号:TC5625C
品牌:道康宁
产品特点:高导热率
适用场合:LED铝板散热
>Details
SC102
产品型号:SC102
品牌:道康宁
产品特点:低渗油,高温稳定性
适用场合:热源与散热器之间的填缝或灌封材料
>Details
TC5121C
产品型号:TC5121C
品牌:道康宁
产品特点:低热阻,高导热率,丝网印刷或点胶
适用场合:CPU导热界面材料
>Details
TC5022
产品型号:TC5022
品牌:道康宁
产品特点:低热阻,高导热率,丝网印刷或点胶
适用场合:CPU导热界面材料
>Details
TC5026
产品型号:TC5026
品牌:道康宁
产品特点:低热阻,高导热率
适用场合:热源与散热器之间的导热
>Details
Dow DOWSIL™ TC-4025 导热垫片 导热胶
产品型号:TC4025
品牌:道康宁
产品特点:高导热率
适用场合:热源与散热器之间的导热
>Details
DOWSIL 1-4173
产品型号:1-4173
品牌:道康宁
产品特点:高导热率
适用场合:热源与散热器之间的导热
>Details
DOWSIL™ SE 4450 Thermally Conductive Adhesive
产品型号:SE4450
品牌:道康宁
产品特点:高导热率
适用场合:电源供应元器件,喷墨打印头,IC和散热器之间的粘合
>Details
DOWSIL SE4485
产品型号:SE4485
品牌:道康宁
产品特点:高导热率
适用场合:PDP模块
>Details
SE4486
产品型号:SE4486
品牌:道康宁
产品特点:高导热率,快速表干
适用场合:电源供应元器件,喷墨打印头,IC和散热器之间的粘合
>Details
Dow DOWSIL™ SE 4420 导热 胶粘剂
产品型号:SE4420
品牌:道康宁
产品特点:快速表干
适用场合:电源供应元器件,喷墨打印头,IC和散热器之间的粘合
>Details
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